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TDK - C1608X7R1E224K080AC - SMD Multilayer Ceramic Capacitor
Tensile Strength N/m²: 135N/mm²
MULTICOMP PRO - MP002353 - Multicore Cable
MULTICOMP PRO - MCHVR12JTET6802 - SMD Chip Resistor
TE CONNECTIVITY - 1-2842144-0 - Pin Header
AGP30 Pad, Protoboard, 160X300, 1F Cif TDK - C1608X7R1E224K080AC - SMDCIF AGP30 Protoboard, Pad, Epoxy Glass Composite, 1. 57mm, 160mm x 300mm Board Type: Matrix Board Board Material: Epoxy Glass Composite Hole Diameter: 1mm External Height: 160mm External Width: 300mm Board Thickness: 1. 57mm SVHC: No SVHC (15 Jan 2019) External Length Height: 160mm Hole Pitch: 2. 54mm Material: Fibreglass Epoxy No. of Copper Coated Sides: 1 Pitch Spacing: 2. 54mm Row Pitch: 0. 54mm
US$ 150.00
US$ 136.95
US$ 1312.99
US$ 1085.49
US$ 52.95
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